Features of precision cleaning for SEMI, LED, OLED, etc.
Process circuit miniature
As plasma power increased,damage increased.
Deposition by product increased.
For control of fine particle
Request for minimizing stock anddecreasing lead time.
Request for improvement on chemicalresistance and resisting abrasion
Large-scaled equipment and parts
Cost increased for large-scaled parts
Cost increased for using highfunctional materials
Optimized and high functional cleaning technologies.(Kit management, Bead, ARC, refurbishment, etc)